The ultra-low residue flux that makes no-clean a reality
Features
- Promises excellent wettability even for OSP finished PCBs.
- Demonstrates 95% or more volatilization in reflow processing and makes "no-clean" a reality.
- Allows underfill to be injected by eliminating the need to remove the residue.
Demonstrates 95% or more volatilization in reflow processing and makes "no-clean" a reality
Allows underfill to be injected by eliminating the need to remove the residue
Spreading of solder (tested on a Cu-OSP finished PCB)
External appearance
