ECO SOLDER alloys and their various forms

SMIC offers an array of solutions in the form of the following alloys and forms that suit various objectives and applications.

Alloy composition (wt%)
Melting temp. (°C) Overview
Solidus
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Peak Liquidus
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ECOSOLDER
M705 Sn-3.0Ag-0.5Cu 217 219 220 Pb free standard solder
M31 Sn-3.5Ag-0.75Cu 217 219 219
M714 Sn-3.8Ag-0.7Cu 217 219 220
M715 Sn-3.9Ag-0.6Cu 217 219 226
M710 Sn-4.0Ag-0.5Cu 217 219 229
M771 Sn-1.0Ag-0.7Cu 217 219 224 Low-Ag content / Ag-free solder
M35 Sn-0.3Ag-0.7Cu 217 219 227
M20 Sn-0.75Cu 227 229 229
M24MT Sn-0.7Cu-Ni-P-Ge 228 230 230
M24AP Sn-0.6Cu-Ni-P-Ge 227 228 228
M805E Sn-0.3Bi-0.7Cu-P 225 229 229
M40 Sn-1.0Ag-0.7Cu-Bi-In 211 222 222
M814 Sn-3.4Ag-0.7Cu-Bi-Sb-Ni-Co 201 222 222 High joint reliability solder
M58 Sn-3.4Ag-0.7Cu-Bi-Sb-Fe-Co 210 221 221
M731 Sn-3.9Ag-0.6Cu-3.0Sb 221 224 226
M716 Sn-3.5Ag-0.5Bi-8.0In 196 208 214
M725 Sn-0.7Cu-Ni-P 228 230 230
M725 Sn-0.7Cu-Ni-P 228 230 230 Solder for power semiconductors
M10 Sn-5.0Sb 240 243 243
M14 Sn-10Sb 245 248 266
M754 Sn-0.6Cu-7Sb 235 239 242
M709 Sn-0.5Ag-6.0Cu 217 226 378 Solder for terminal processing
M760HT Sn-5.0Cu-0.15Ni-P-Ga 228 229 365
M770 Sn-2.0Ag-Cu-Ni 218 220 224 Highly joint reliable solder for semiconductor PKG
M850 Sn-3.5Ag-0.8Cu-Bi-Ni-Co-Ge 217 221 221
M758 Sn-3.0Ag-0.8Cu-Bi-Ni 205 215 215
M832 Sn-3.5Ag-0.8Cu-Bi-Ni 203 214 214
M807 Sn-3.5Ag-0.8Cu-Bi-Ni 214 219 219
M705RK Sn-3.0Ag-0.5Cu-Fe-Zr 219 221 221 Solder for iron tip erosion prevention
M20RK Sn-0.75Cu-Fe-Zr 227 229 229
M35RK Sn-0.3Ag-0.7Cu-Fe-Zr 217 219 227
MILATERA
L20 Sn-58Bi 139 141 141 Low temperature solder
L23 Sn-57Bi-1Ag 138 140 204
L27 Sn-40Bi-Cu-Ni 139 140 174
L28 Sn-35Bi-Cu-Ni 141 143 182
L29 Sn-58Bi-Sb-Ni 140 145 145
  • Peak: Endothermic peak on a DSC (Differential Scanning Calorimetry) curve.
  • Some alloy compositions may not be available in certain forms with special product size and grade.

 

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