SMIC offers an array of solutions in the form of the following alloys and forms that suit various objectives and applications.
| ECO SOLDER |
Alloy composition (wt%) |
Melting temp. (°C) | Overview | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Solidus line |
Peak | Liquidus line |
|||||||
| M-series medium temperature solder | |||||||||
| M705 | Sn-3.0Ag-0.5Cu | 217 | 219 | 220 | Pb free standard solder | ||||
| M31 | Sn-3.5Ag-0.75Cu | 217 | 219 | 219 | |||||
| M714 | Sn-3.8Ag-0.7Cu | 217 | 219 | 220 | |||||
| M715 | Sn-3.9Ag-0.6Cu | 217 | 219 | 226 | |||||
| M710 | Sn-4.0Ag-0.5Cu | 217 | 219 | 229 | |||||
| M771 | Sn-1.0Ag-0.7Cu | 217 | 219 | 224 | Low-Ag content / Ag-free solder | ||||
| M35 | Sn-0.3Ag-0.7Cu | 217 | 219 | 227 | |||||
| M20 | Sn-0.75Cu | 227 | 229 | 229 | |||||
| M725 | Sn-0.7Cu-Ni-P | 228 | 230 | 230 | |||||
| M24MT | Sn-0.7Cu-Ni-P-Ge | 228 | 230 | 230 | |||||
| M24AP | Sn-0.6Cu-Ni-P-Ge | 227 | 228 | 228 | |||||
| M805E | Sn-0.3Bi-0.7Cu-P | 225 | 229 | 229 | |||||
| M40 | Sn-1.0Ag-0.7Cu-Bi-In | 211 | 222 | 222 | |||||
| M814 | Sn-3.4Ag-0.7Cu-Bi-Sb-x | 201 | 222 | 222 | High joint reliability solder | ||||
| M58 | Sn-3.4Ag-0.7Cu-Bi-Sb-x | 210 | 221 | 221 | |||||
| M731 | Sn-3.9Ag-0.6Cu-3.0Sb | 221 | 224 | 226 | |||||
| M716 | Sn-3.5Ag-0.5Bi-8.0In | 196 | 208 | 214 | |||||
| M10 | Sn-5.0Sb | 240 | 243 | 243 | Medium-high temperature solder | ||||
| M14 | Sn-10Sb | 245 | 248 | 266 | |||||
| M709 | Sn-0.5Ag-6.0Cu | 217 | 226 | 378 | Solder for terminal processing | ||||
| M760HT | Sn-5.0Cu-0.15Ni-x | 228 | 229 | 365 | |||||
| M770 | Sn-2.0Ag-Cu-Ni | 218 | 220 | 224 | Highly joint reliable solder for semiconductor PKG | ||||
| M850 | Sn-3.5Ag-0.8Cu-Bi-Ni-x | 217 | 221 | 221 | |||||
| M758 | Sn-3.0Ag-0.8Cu-Bi-Ni | 205 | 215 | 215 | |||||
| M832 | Sn-3.5Ag-0.8Cu-Bi-Ni | 203 | 214 | 214 | |||||
| M807 | Sn-3.5Ag-0.8Cu-Bi-Ni | 214 | 219 | 219 | |||||
| M705RK | Sn-3.0Ag-0.5Cu-x | 219 | 221 | 221 | Solder for iron tip erosion prevention | ||||
| M20RK | Sn-0.75Cu-x | 227 | 229 | 229 | |||||
| M35RK | Sn-0.3Ag-0.7Cu-x | 217 | 219 | 227 | |||||
| L-series low temperature solder | |||||||||
| L20 | Sn-58Bi | 139 | 141 | 141 | Low temperature solder | ||||
| L23 | Sn-57Bi-1Ag | 138 | 140 | 204 | |||||
| L27 | Sn-40Bi-Cu-Ni | 139 | 140 | 174 | |||||
| L28 | Sn-35Bi-Cu-Ni | 141 | 143 | 182 | |||||
| L29 | Sn-58Bi-Sb-Ni | 140 | 145 | 145 | |||||
- ・Peak: Endothermic peak on a DSC (Differential Scanning Calorimetry) curve.
- ・Some alloy compositions may not be available in certain forms with special product size and grade.
