SMIC Senju Metal Industry Co., Ltd.
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Plating anode
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Products
Flux
Semiconductor flux
02
Semiconductor flux
Products
Flux for packaging
Application: Chip attach
Water solubility
Reflow/TCB
Transfer
WF-6317/WF-6450
Printing
WF-6317P/WF-6457
Spray
SPK-340
Rosin
Reflow
Transfer
GTN-68/GTN-68 (HF)
Printing
GTN-68P/GTN-68P (HF)
Low-residue type
Reflow
Transfer
901K5
Printing
901T1SP
TCB
Transfer/Spray
NRF-SP1
Application: Ball attach
Water solubility
Reflow
Transfer
WF-6317/WF-6450
Printing
WF-6317P/WF-6457
Rosin
Reflow
Transfer
GTN-68/GTN-68 (HF)
Printing
GTN-68P/GTN-68P (HF)
Epoxy
Reflow
Transfer
JPK9S/EF-100*1
Printing
EF-100P
Flux for micro bumping
Application: Micro ball attach
Water solubility
Reflow
Printing
WF-6457
Rosin
Reflow
Transfer
MB-T100
Application: Fusing
Water solubility
Reflow
Spraying/Spin coating
SPK-3420
Rosin
Reflow
Spraying/Spin coating
7200A
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Products
Lead-free solder
Solder alloys
Alloy List
Flux cored solder
Solder paste
Solder preform
Solder balls
Flux
Post flux
Semiconductor flux
Lead-containing solder
Lead-containing flux cored solder
Lead-containing solder paste
Pureloy wire
Factory automation (FA) equipment
Reflow oven
Flow soldering machine
Spray fluxer
Solder recycle machine
Sintering technology/products
Multilayer plain bearing
Metal-based plain bearings
Plating anode
