A device that uses multiple heating / cooling units to perform soldering with temperature control suitable for PCB and solder paste. It plays an important role in manufacturing high-performance electronic devices.
01 Reflow oven
|For component soldering||Nitrogen atmosphere||Details|
|For high temperature solder||Nitrogen atmosphere||Details|
|For bump formation||Nitrogen atmosphere||Details|
|For Power Devices||Vacuum||Details|
|For power devices and PCB||Vacuum and nitrogen atmosphere||Details|
|For component soldering||Air atmosphere||Details|