01 Reflow oven

Reflow

A device that uses multiple heating / cooling units to perform soldering with temperature control suitable for PCB and solder paste. It plays an important role in manufacturing high-performance electronic devices.

Products

For component soldering Nitrogen atmosphere

SNR-GT Ⅱ Series

A next-generation environmentally-conscious reflow oven
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SNR-GT-D Series

Dual lanes provide twice the production output
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SNR-GT-W Series

Non-stop Operation with Independent Double Chamber
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SNR-GT Series

Standard model with enhanced basic functions
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For high temperature solder Nitrogen atmosphere

SNR-GT-H Series

The SNR-GT-H Series achieves the 420℃ temperature profile
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For bump formation Nitrogen atmosphere

SNR-MB Series

Supports mounting of small solder balls using gentle hot air
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For Power Devices Vacuum

SVR-625GT-C

Reduces voids with a design that is familiar with the properties of soldering materials
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For power devices and PCB Vacuum and nitrogen atmosphere

SVR-1040GT-PC

Switching between vacuum and reflow modes to enable various production forms
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For component soldering Air atmosphere

SAR-825GT

Air reflow oven that utilizes know-how of many years
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STR-2010 Series

Compact, yet delivers highly reliable soldering
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