A device that uses multiple heating / cooling units to perform soldering with temperature control suitable for PCB and solder paste. It plays an important role in manufacturing high-performance electronic devices.
01 Reflow oven
Products
| For component soldering | Nitrogen atmosphere |
SNR-GT Ⅱ SeriesA next-generation environmentally-conscious reflow oven |
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SNR-GT-D SeriesDual lanes provide twice the production output |
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SNR-GT-W SeriesNon-stop Operation with Independent Double Chamber |
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SNR-GT SeriesStandard model with enhanced basic functions |
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| For high temperature solder | Nitrogen atmosphere |
SNR-GT-H SeriesThe SNR-GT-H Series achieves the 420℃ temperature profile |
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| For bump formation | Nitrogen atmosphere |
SNR-MB SeriesSupports mounting of small solder balls using gentle hot air |
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| For Power Devices | Vacuum |
SVR-625GT-CReduces voids with a design that is familiar with the properties of soldering materials |
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| For power devices and PCB | Vacuum and nitrogen atmosphere |
SVR-1040GT-PCSwitching between vacuum and reflow modes to enable various production forms |
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| For component soldering | Air atmosphere |
SAR-825GTAir reflow oven that utilizes know-how of many years |
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