Reinforces the area where the amount of solder is insufficient
Features
- Unique pressing technique allows flattening of all four bonding faces of the chips
- Chip mounter makes automatic mounting possible
- Joint reinforcement of pin thru-hole components using reflow
Example of use
Unique pressing technique allows flattening of all four bonding faces of the chips
Automatic chip solder mounting simultaneously with electronic components
Joint reinforcement of pin thru-hole components using reflow
