ULT369 Series

ULT369

Updated universal solder paste

Features

  • Improved printability and wettability.
  • Suppresses BGA Non-Wet Open (NWO) and voids.

Improved stencil life by suppressing the reaction between solder powder and flux

Improved stencil life by suppressing the reaction between solder powder and flux

Suppressed voids by improving flux fluidity

SSuppressed voids by improving flux fluidity

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