JPP Series

JPP Series

Reinforces the joint strength by flux

Features

  • Epoxy resin contained in flux contributes to the improvement of the drop and thermal resistance.
  • Can be stored in a refrigerator.
  • Applicable to flexible substrate such as polyamide and PET.
 

Optimal for joint reinforcement with components and improving drop impact resistance of brittle Sn-Bi solder

Optimal for joint reinforcement with components and improving drop impact resistance of brittle Sn-Bi solder

  

Thermal cycle test

Thermal cycle test

  

Drop impact resistance test

Drop impact resistance test

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