Exhibition Report: "10th Int'l Automotive Electronics Technology Expo"

  • A view of the exhibition site of the "10th Int'l Automotive Electronics Technology Expo"
  • A view of the exhibition site of the "10th Int'l Automotive Electronics Technology Expo"
  • A view of the exhibition site of the "10th Int'l Automotive Electronics Technology Expo"
  • A view of the exhibition site of the "10th Int'l Automotive Electronics Technology Expo"
  • A view of the exhibition site of the "10th Int'l Automotive Electronics Technology Expo"
  • A view of the exhibition site of the "10th Int'l Automotive Electronics Technology Expo"

Senju Metal Industry Co., Ltd. presented its exhibit at the 10th Int'l Automotive Electronics Technology Expo held at Tokyo Big Sight for three days from January 17 (Wed) to January 19 (Fri), 2018, coinciding with NEPCON JAPAN 2018. Under the "BEYOND CONNECTION" theme, SMIC exhibited solutions related to automobiles, electrification, the Internet of Things (IoT), and artificial intelligence (AI). Thank you for visiting our booth.

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Heat dissipation improvements

  • "Solder Alloy M794" Thermal Fatigue Resistant Alloy Developed with New Metal Bonding Mechanism

  • "Solder Paste ULT369" New Standard Products through SMI Process Feedback

  • "Solder preforms containing Ni balls" Expected Heat Dissipation By Uniform Solder Thickness

Insulation improvements

  • "Flux Cored Solder Macros" Prevents Cracking by Thermal Fatigue and Shock

  • Solder Paste C3T Prevents Thermal Fatigue Cracks and Whiskers

New Method

  • Flux Cored Solder SEN M705RK Prevents Splashing, Erosion & Contamination of Iron Tip

  • Solder Paste NRB Non-residue & Void-free Achieved with a Vacuum Reflow Oven

  • Solder Paste JPP Thermal Curing with Reflow for Reducing the Number of Processes

Non-stop operation

  • Reflow oven SNR-GT-W Non-stop Operation with Independent Double Chamber

The Era of Phthalate-Free