Senju Metal Industry Co., Ltd. presented its exhibit at the 10th Int'l Automotive Electronics Technology Expo held at Tokyo Big Sight for three days from January 17 (Wed) to January 19 (Fri), 2018, coinciding with NEPCON JAPAN 2018. Under the "BEYOND CONNECTION" theme, SMIC exhibited solutions related to automobiles, electrification, the Internet of Things (IoT), and artificial intelligence (AI). Thank you for visiting our booth.
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Heat dissipation improvements
"Solder Alloy M794"
Thermal Fatigue Resistant Alloy Developed with New Metal Bonding Mechanism
"Solder Paste ULT369"
New Standard Products through SMI Process Feedback
"Solder preforms containing Ni balls"
Expected Heat Dissipation By Uniform Solder Thickness
Flux Cored Solder SEN M705RK
Prevents Splashing, Erosion & Contamination of Iron Tip
Solder Paste NRB
Non-residue & Void-free Achieved with a Vacuum Reflow Oven
Solder Paste JPP
Thermal Curing with Reflow for Reducing the Number of Processes
The Era of Phthalate-Free