These products are manufactured by processing solder alloys into various geometries and structures. Optimal soldering is achieved by selecting the appropriate alloy composition, dimensions, and one of five distinct preformed shapes.
Regarding Solder preform, we have compiled a list of Shape, Internal structure, Processed shape etc.
By incorporating a precise volume of Ni filler within the preform, this product ensures optimal bond line thickness and component parallelism, delivering superior joint reliability.
Incorporating solid flux into the preform enables simultaneous supply of solder and flux. This eliminates the flux application step and provides excellent wettability.
This is a tape-shaped preform wound on a reel. It can be cut to any length to create multiple sizes and allows adjustment of the solder volume.
This is a ring-shaped preform. Suitable for applications requiring simultaneous, precise solder supply to multiple points, such as connector pins.
This is a square-shaped preform. It provides consistent solder coverage over large surface area. Ideal for components requiring high thermal conductivity or specific performance.
This is a circular-shaped preform. Supplies the appropriate amount of solder in a size suitable for bonding components.
This is a rectangular-shaped preform. Available in sizes to match chip components and is compatible with automated pick-and-place mounters. Ideal for solder fortification in areas with insufficient volume, facilitating fully automated re-soldering.
＊We can process various shapes and dimensions to meet customer requirements. 
