Solder paste

Solder paste

Blended with a fine powder solder alloy and high-performance flux

Solder paste is produced by blending fine solder powder with a high-viscosity flux to form a paste. It serves as an essential interconnect material in modern electronics manufacturing, used across a wide range of applications from common household appliances to automobiles and servers.

Solder paste list

Regarding Solder paste, we have compiled a list of Application method, Heating method, Cleaning requirement, Key characteristics etc.

See details in the catalog

Main products

ULT880 Series

Next-generation general-purpose
solder pasteULT880 SeriesPFAS Free

Recommended alloysM705M58
  • Compatible with a wide range of applications from SAC305 to thermal fatigue resistant solder.
  • Excellent wetting on lead ends improves inspection yield.
  • Achieves low voids across all component types.
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LS720V Series

Low-silver solder pasteLS720V SeriesPFAS Free

Recommended alloysM40
  • Achieves low silver content while maintaining characteristics equivalent to SAC305.
  • Excellent wetting and minimal voiding are achievable even under air reflow.
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RTP Series

Solder paste for room-temperature
storageRTP SeriesPFAS Free

Recommended alloysM705M40
  • Suppresses reactions between solder powder and flux, enabling room-temperature transport and storage.
  • Suitable for continuous operation with paste replenishment, helping to reduce material waste.
  • Exhibits low voids and stable wettability even after three months of room-temperature storage.
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S280-T Series

Air-reflowable, residue-crack-suppressing
solder pasteS280-T SeriesPFAS Free

Recommended alloysM705
  • Suitable for air reflow, contributing to lowered CO2 emissions.
  • Suppresses flux residue cracking, which reduces the risk of insulation degradation due to condensation.
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DLN258-ZH Series

Solder paste for area-laser heating DLN258-ZH SeriesPFAS Free

Recommended alloysM705
  • Suitable for area laser heating of inserted components.
  • Exhibits excellent wettability under rapid heating.
  • Reduces solder balls caused by slumping and splattering.
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RGS800 Series

Solder paste for fine-pitch printingRGS800 SeriesPFAS Free

Recommended alloysM705
  • Suitable for the assembly of increasingly miniaturized advanced electronic components.
  • Ensures stable printing volume even through fine apertures.
  • Achieves wetting properties tailored to the characteristics of fine solder powder.
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NTS333n Series

Solder paste for both cleaning and
no-clean applicationsNTS333n SeriesPFAS Free

Recommended alloysM705M58
  • Provides excellent performance in both cleaning and no-clean environments.
  • Utilizes nanotechnology to suppress electrochemical migration (ECM).
  • Exhibits superior cleanability with all types of cleaners.
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JPP Series

Joint reinforcement solder pasteJPP SeriesPFAS Free

Recommended alloysM705
  • Adhesive flux properties deliver superior joint strength after assembly.
  • Achieves both soldering and underfill in a single reflow process.
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NXD300ZH Series

Laser-compatible solder pasteNXD300ZH SeriesPFAS Free

Recommended alloysM705M10M14
  • Optimized for laser heating with exceptional wettability.
  • Superior dispensing stability with high component retention.
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NXD400ZH Series

Solder paste with excellent wettability for
dispensing applicationsNXD400ZH SeriesPFAS Free

Recommended alloysM705
  • Exhibits excellent wettability on nickel and nickel silver.
  • Achieves superior continuous dispensing stability.
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NXD900ZH

Solder paste for jet dispensing processNXD900ZHPFAS Free

Recommended alloysM705M14
  • Enables non-contact, high-speed selective dispensing of solder paste.
  • Suitable for micro-dispensing, and achieves stable continuous application.
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DB800 Series

Solder paste for water-based cleaning
agentDB800 SeriesPFAS Free

Recommended alloysM705M754M10M731
  • Exceptional cleanability with water-based cleaning agents.
  • Effectively reduces voids in power semiconductors.
  • Product lineup is adapted for printing and dispensing.
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GSN10 Series

Solder paste for reducing atmosphere
heatingGSN10 SeriesPFAS Free

Recommended alloysM705M754M10M731
  • Leveraging the reducing atmosphere to eliminate the need for activators and enable a completely no-clean process.＊Reducing atmosphere examples: Formic acid, H2 + N2 mixture.
  • Exhibits excellent void reduction effect.
  • Attitude control possible with Ni filler addition.
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WSG83 Series

Water-washable solder pasteWSG83 SeriesPFAS Free

Recommended alloysM705M58M10
  • Excellent solderability for BGA packages, reducing non-wetting defects and voids.
  • Superior cleanability even at low water temperatures (20°C), improving cleaning process　 efficiency.
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BPS40 Series

Bump-forming solder pasteBPS40 SeriesPFAS Free

Recommended alloysM705
  • Achieves excellent printability suitable for fine bump formation.
  • Optimized melting behavior during heating reduces voids.
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NRB60 Series

No- residue type solder pasteNRB60 SeriesPFAS Free

Recommended alloysM705M10
  • Post-reflow residue is reduced to approx. 1%, making it ideal for no-clean processes.
  • Achieves a void area ratio of less than 2% when used in combination with vacuum reflow ovens.
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NRB71 Series

No- residue type solder pasteNRB71 SeriesPFAS Free

Recommended alloysM705M754M10M14
  • Residue after heating is reduced to 5% or less for a beautiful finish.
  • Enables reflow at an O2 concentration of 1,000 ppm for excellent mountability.
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