These spherical solder balls are primarily used for semiconductor bump formation. Offering exceptional sphericity and strict dimensional control, they ensure highly stable solder volume. Options include pure solder alloy spheres and copper-core balls with solder-plated surfaces.
Solder balls are an essential material for modern semiconductor bump formation. We offer a wide range of compositions and sizes to meet various package types, pitches, and performance requirements.
These are solder-plated copper core balls. They maintain a consistent standoff height during reflow. This structure offers superior resistance to electrochemical migration in fine-pitch assemblies while enhancing thermal dissipation.
Soft errors occur when trace amounts of alpha particles or cosmic rays, emitted from solder or semiconductor materials, flip data bits within memory. Flip-chip packages are particularly susceptible to these errors, necessitating the use of electronic materials with low-alpha characteristics. Our Low Alpha Solder (LAS) was specifically developed to meet these requirements.
