Post flux

Post flux

Liquid flux for improved solderability

An essential liquid formulation for wave and selective soldering, this flux utilizes a solvent base to dissolve rosin and activators, enhancing solderability. It is compatible with various application methods - including spraying, dipping, brushing, and foaming - and ensures exceptional post-soldering insulation reliability.

Post flux list

Regarding Post flux, we have compiled a list of products by application and characteristics.

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Main products

Post flux for printed circuit board
assemblyES-1100/ES-1100C/ESR-1100MPFAS Free

Recommended alloysM705M24MTM24AP
  • Achieves a clean finish using nearly colorless refined rosin.
  • Newly developed additive that effectively reduces solder balls.
  • Lineup includes versatile ES-1100, low-solid type ES-1100C with enhanced cleanability, and IPC ROL1 compliant ESR-1100M that provides superior insulation reliability.
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Post flux for printed circuit board
assemblyES-Z-15PFAS Free

Recommended alloysM705
  • Halogen-free type compliant with IPC ROL0.
  • Ensures wettability equivalent to ROL1 type.
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Post flux for printed circuit board
assemblyEZR-01SPFAS Free

Recommended alloysM705M24MTM24AP
  • Ensures excellent workability and high surface insulation through the optimal blending of base rosin and activators.
  • Low residue type with excellent inspectability.
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M58

Post flux for printed circuit board
assemblyLT-1600Y2PFAS Free

Recommended alloysL20L199
  • Activity temperature range is optimized for Sn-Bi-based low-temperature solder.
  • Optimized flux viscosity ensures adequate fillet thickness.
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Terminal tinning flux T-1/T-5PFAS Free

Recommended alloysM705
  • Designed specifically for pre-soldering lead wires.
  • Extremely low solid content (1%) for a clean finish.
  • Lineup includes T-1 with excellent wettability and halogen-free T-5.
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TY-8/NO.48M

Terminal tinning flux TY-8/NO.48MPFAS Free

Recommended alloysM705M709M760HT
  • Designed specifically for coil component manufacturing.
  • Exhibits excellent heat resistance, which is suitable for soldering above 400°C.
  • Lineup features TY-8 with superior wettability and halogen-free NO.48M.
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Lead frame flux405FPFAS Free

Recommended alloysM705M20
  • Designed specifically for materials that are difficult to solder, such as stainless steel.
  • Exhibits excellent heat resistance, which allows for burner heating.
    ＊Due to the high corrosiveness, thoroughly rinse and dry completely after cleaning.
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Lead frame fluxWF-55GFPFAS Free

Recommended alloysM705
  • Designed specifically for the hot-dip solder plating of lead frames.
  • Produces a clean finish with minimal bridging and icicles.
  • Glycolic acid-free design that is compliant with specific chemical substance regulations.
    ＊Due to the high corrosiveness, thoroughly rinse and dry completely after cleaning.
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