Reduced environmental impact

Lowering assembly temperatures reduces heat dissipation from equipment, easing factory air conditioning loads and cutting overall power consumption. Furthermore, Bi emits less CO₂ during the refining process compared to other common solder elements, such as Tin and Silver.

Increased freedom in selecting electronic and electrical components

MILATERA enables the use of components and substrates with lower heat resistance, expanding design flexibility and contributing to overall cost reduction through a wider range of material choices.

Improved assembly quality

As high-performance semiconductor packages become increasingly compact and thin, this technology mitigates defects caused by thermally induced warpage. Lowering the assembly temperature minimizes deformation and enhances overall assembly quality.