Flux for semiconductors

Flux products optimized for semiconductor applications based on usage

These flux products are designed for the temporary fixation (tacking) of solder balls and chips while ensuring excellent solderability. They are precisely formulated to accommodate various bump sizes, pitches, application methods, and cleaning processes to deliver optimal performance.

Semiconductor package interconnects and compatible fluxes

Semiconductor packages feature a high density of internal interconnects with varying sizes, pitches, and materials. Our specialized fluxes are engineered to ensure superior joint integrity across these diverse applications.