Sparkle Flux WF6317 Series

WF6317

Excellent solder wettability makes void-free soldering possible

Features

  • Possesses a good wettability and stable solder ball retention ability.
  • Easy-to-clean, water-soluble flux that supports a reflow temperature of 250°C.
  • Low-volatility flux suppresses contamination inside the reflow oven.

Excellent squeezing ability and ball retention ability facilitate easy mounting of solder balls

Excellent squeezing ability and ball retention ability facilitate easy mounting of solder balls

Within 8 hours of mounting, flux residue can be removed with water

Within 8 hours of mounting, flux residue can be removed with water

Flux residue can be completely removed by cleaning with hot water (40°C)

Flux residue can be completely removed by cleaning with hot water (40°C)

Possesses excellent wettability even on Cu-OSP finished PCBs

Possesses excellent wettability even on OSP finished PCBs

Uses a low-volatility flux to suppress contamination inside the reflow oven

Uses a low-volatility flux to suppress contamination in the reflow ovens

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