• Possesses a good wettability and stable solder ball retention ability.
• Easy-to-clean, water-soluble flux that supports a reflow temperature of 250°C.
• Low-volatility flux suppresses contamination inside the reflow oven.

Excellent squeezing ability and ball retention ability facilitate easy mounting of solder balls

Within 8 hours of mounting, flux residue can be removed with water

Flux residue can be completely removed by cleaning with hot water (40°C)

Possesses excellent wettability even on Cu-OSP finished PCBs

Uses a low-volatility flux to suppress contamination inside the reflow oven