Excellent solder wettability makes void-free soldering possible
Features
- Possesses a good wettability and stable solder ball retention ability.
- Easy-to-clean, water-soluble flux that supports a reflow temperature of 250°C.
- Low-volatility flux suppresses contamination inside the reflow oven.
Excellent squeezing ability and ball retention ability facilitate easy mounting of solder balls
Within 8 hours of mounting, flux residue can be removed with water
Flux residue can be completely removed by cleaning with hot water (40°C)
Possesses excellent wettability even on Cu-OSP finished PCBs
Uses a low-volatility flux to suppress contamination inside the reflow oven