N2 Atmosphere Reflow Oven - Bump Formation TypeSNR-MB Series

Supports mounting of small solder balls using gentle hot air

  • Notebook PC
  • 3-block control
  • Cooling unit
  • Heated zone flux management system
  • PCB fall sensor
  • Oxygen analyzer
  • Maintenance timer
  • Signal tower
  • PCB warp prevention mechanism
  • Automatic conveyor width adjust
  • In-out feeder free rollers
  • Chiller unit
  • Automatic oxygen concentration control (500 - 3000 ppm)
  • ECO-mode operation divided in 8 blocks
  • Up/down mechanism of top-bottom labyrinth curtains
  • UPS
  • Display in English and Chinese
  • Specific color
  SNR-725MB SNR-1346MB
Dimensions (L×W×H) 3,000 x 1,326 x 1,430 mm 6,820 x 1,440 x 1,390 mm
Conveyor height 900±20 mm 900±20 mm
Conveyor speed 0.3 - 2.0 m/min 0.3 - 2.0 m/min
Board dimensions W: 50 - 250, L: 100 - 300, T: 0.8-3.0 mm W: 50 - 460, L: 100 - 500, T: 0.8 - 3.0 mm
Component height ≦10mm [OP:30mm], ≧5mm [OP:25mm] ≦10mm [OP:20mm], ≧5mm [OP:20mm]
Heated zones 7 13
Cooling zones 1 2
Side edge clearance(select one) 3 or 4 or 5 mm 3 or 4 or 5 mm
N2 (Nitrogen) gas supply ≧99.999%, ≧0.4MPaG, max. 350NL/min ≧99.999%, ≧0.4MPaG, max. 600NL/min
N2 (Nitrogen) gas usage Component height/STD:≦10mm, ≧5mm 250NL/min 600NL/min
Power requirement 200V, max. 30 kw, 90A, 3-phase 200V, max. 63 kw, 200A, 3-phase

Inquiries regarding this product

Contact us