
Energy-saving automatic stable pressure flow type soldering system
- Adoption of NH deflect plate makes stable pressure and mirror surface-like solder flow
- Enhanced through-hole fillings by strengthened preheaters and stronger wave pressure
Stable Pressure Flow
- Eliminates the need for a stabilizing plate
- Allows easy pot cleaning without disassembly
- Stable flow wave

- Without a stabilizing plate, no clogging of oxide occurs and offering stable solder flow

A primary nozzle suitable for the workpiece can be selected

- Stable flow wave is compatible with a flow wave height of over 10 mm
- Full chamber system
- Equipped with a flux management system as standard
- Ensures high quality of the product
- Reduces oxide of solder
- Easy-maintenance structure
- Solder splashing protection cover as a standard feature
Stable higher wave realized by the NH deflecting plate
Comparison of wave conditions

With a conventional deflecting plate

With a NH deflecting plate
Flow wave height
with a conventional deflecting plate

Flow wave height
with a NH deflecting plate


N-Series for N² ambient wave soldering


Stable pressure Solder pot

- Touch panel + PLC control
- Preheaters: IR panel heater × 4
- Conveyor height 780 ±20 mm
- Conveyor resin fingers
- External flow volume
- Width adjustment indicator
- PCB bottom surface cooling fan unit
- Signal tower
- Loading/unloading chain conveyor with flanges
- Oxygen analyzer (N-Series)
- Automatic solder pot in/out and up/down mechanism (N-Series)
- Solder splash protection cover (N-Series)
- Full nitride coating
- Nail cleaning unit
- Conveyor elevating mechanism
- Solder pot connector specifications
- Pulsating jet flow
- Wave-height side guide
- Caster
- Soldering pot automatic up & down (N Series: standard)
- Soldering pot automatic in & out(N Series: standard)
SPF2-300 | SPF2-300N | ||
---|---|---|---|
Dimensions (L×W×H) | 4,340 x 1,340 x 1,540 mm | 4,340 x 1,340 x 1,540 mm | |
Conveyor height | 780 ±20mm | 780 ±20mm | |
Conveyor speed | 0.5 - 2.0 m/min | 0.5 - 2.0 m/min | |
PCB dimensions (W×L) | 50 x 100 - 300 x 450 mm | 50 x 100 - 300 x 450 mm | |
Component height (highest) | ≦100mm, ≧5mm | ≦50mm, ≧5mm | |
Preheater (heated zone length) | 1,600 (400/zone x 4) mm | 1,600 (400/zone x 4) mm | |
Solder pot capacity (approx.) | 360kg (M705, Sn - 3.0Ag - 0.5Cu) | 360kg (M705, Sn - 3.0Ag - 0.5Cu) | |
N2 (Nitrogen) gas supply | - | ≧99.999%, ≧0.3MPaG, max. 700NL/min | |
N2 (Nitrogen) gas usage | Component height/STD:≦100mm, ≧5mm *Exit side labyrinth height:Same as PCB transfer |
- | 300NL/min |
Air supply | - | ≧0.5MPaG | |
Power requirement | 200V, approx. 32.5kW, 100A, 3-phase | 200V, approx. 32.9kW, 100A, 3-phase |
SPF2-400 | SPF2-400N | ||
---|---|---|---|
Dimensions (L×W×H) | 4,340 x 1,340 x 1,540 mm | 4,340 x 1,340 x 1,540 mm | |
Conveyor height | 780 ±20mm | 780 ±20mm | |
Conveyor speed | 0.5 - 2.0 m/min | 0.5 - 2.0 m/min | |
PCB dimensions (W×L) | 50 x 100 - 400 x 450 mm | 50 x 100 - 400 x 450 mm | |
Component height (highest) | ≦100mm, ≧5mm | ≦50mm, ≧5mm | |
Preheater (heated zone length) | 1,600 (400/zone x 4) mm | 1,600 (400/zone x 4) mm | |
Solder pot capacity (approx.) | 360kg (M705, Sn - 3.0Ag - 0.5Cu) | 360kg (M705, Sn - 3.0Ag - 0.5Cu) | |
N2 (Nitrogen) gas supply | - | ≧99.999%, ≧0.3MPaG, max. 700NL/min | |
N2 (Nitrogen) gas usage | Component height/STD:≦100mm, ≧5mm *Exit side labyrinth height:Same as PCB transfer |
- | 300NL/min |
Air supply | - | ≧0.5MPaG | |
Power requirement | 200V, approx. 32.5kW, 100A, 3-phase | 200V, approx. 32.9kW, 100A, 3-phase |
SPF2-500 | SPF2-500N | ||
---|---|---|---|
Dimensions (L×W×H) | 4,640 x 1,440 x 1,540 mm | 4,640 x 1,440 x 1,540 mm | |
Conveyor height | 780 ±20mm | 780 ±20mm | |
Conveyor speed | 0.5 - 2.0 m/min | 0.5 - 2.0 m/min | |
PCB dimensions (W×L) | 50 x 100 - 500 x 600 mm | 50 x 100 - 500 x 600 mm | |
Component height (highest) | ≦100mm, ≧5mm | ≦50mm, ≧5mm | |
Preheater (heated zone length) | 1,600 (400/zone x 4) mm | 1,600 (400/zone x 4) mm | |
Solder pot capacity (approx.) | 520kg (M705, Sn - 3.0Ag - 0.5Cu) | 520kg (M705, Sn - 3.0Ag - 0.5Cu) | |
N2 (Nitrogen) gas supply | - | ≧99.999%, ≧0.3MPaG, max. 700NL/min | |
N2 (Nitrogen) gas usage | Component height/STD:≦100mm, ≧5mm *Exit side labyrinth height:Same as PCB transfer |
- | 450NL/min |
Air supply | - | ≧0.5MPaG | |
Power requirement | 200V, approx. 32.5kW, 100A, 3-phase | 200V, approx. 32.9kW, 100A, 3-phase |