Selective Dip Soldering MachineSOLZEUS SNF Series

SOLZEUS SNF Series

Automatic selective dip-soldering machine best suited for high-mix low-volume production

The robot conveys the PCB to the nozzle

  • The newly developed automatic width adjustable nozzle makes it possible that just one nozzle accepts different items
  • The newly developed programing using digitizer (laser pointing) for easy operations
  • 6-axis robot achieves reduction in size and price
  • Incorporation into production lines is possible with in-line system

  • Automatic width adjust of PCB conveyor rail and holders
  • Flux Flowmeter (leak detection)
  • Upper pre-heater unit (3 halogen lamps)
  • PCB size for out of specification (please consult)
  SNF-2017ST
Dimensions (L×W×H) 2,150 x 1,300 x 1,500 mm
Weight (Approx.) 1,500 kg
Utility 3-Phase 200 V ± 10% 19 kVA AIR;40 l/min φ10 joint N2;10 l/min φ10 joint
Board dimensions W: 100 - 250, L: 100 - 200, T: max. 40 mm (from PCB topside), PCB edge dead space: 3 mm or more
Transfer system PCB traveling by 6-axis robot with chuck (operable by touch panel)
Fluxer unit Pressurized Spraying Nozzle (XY Drive),Upward/downward-moving mist collection duct
Preheating Halogen lump (1.2 kw × 6),Heat-resistant glass
Soldering Point soldering nozzles for variable width, Solder Pot: 100 kg, Servo motor system for soldering pump,/ Corrosion-proof surface treatment using Hot N2
Cooling unit Cooling fan with air

*Products in MPF series can be customized upon request of the customer; please contact our sales representative

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