Surface Dip Soldering Machine SOLZEUS LPF Series

SOLZEUS LPF-2008L

Mixed production under single condition with easy machine setting

  • The Deep soldering bath accepts long lead shape items
  • Solder pot

Achieves highly reliable mounting by wave motors that keep stable surface with fresh heat

  • Top pre-heater unit (6 halogen lamps)
  • Flux Flowmeter (leak detection)
  • Cooling fan unit
  LPF-2008L
Dimensions (L×W×H) 4,380 x 1,060 x 1,570 mm
Utility 3-phase, AC 200V, 24kVA, AIR: φ10joint
PCB dimensions W: 50 - 360, L: 50 - 410, T: max. 90mm (From PCB topside), Bottom clearance: max. 50mm
Transfer system Conveyor pallet vertical rotation system
Fluxer unit Pressurized spraying nozzle
Preheater unit Halogen lump (1.0kW x 12), Heat-resistant glass
Soldering Whole-surface wave soldering, Solder pot capacity: 400kg, Motor system wave pump, Corrosion-proof surface treatment
Cooling unit Cooling fan with air

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