RGS800 Series

RGS800 Series

Applicable to type6 solder powder

Features

  • Enables packaging of 0201 (mm) microchip components by using Type6.
  • Ensures good wettability despite using Type6.


Soldering of 0201 (mm) components


Ball-shaped solder alloy powder manufactured by our granulation technology

Ball-shaped solder alloy powder manufactured by our granulation technology

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