LS720V Series

Low-Silver & Silver-free Solder Pastes

Cost reduction by low-Ag

Features

  • Halogen-free is also available.
  • The equivalent profile of M705 (SAC305) can be applied to M40-LS720V.
  • Joint reliability of Sn-Cu solder is enhanced through the addition of materials such as Ag, Bi and/or Ni.


Evaluation on chip resistors


Comparison of microstructure

Comparison of microstructure

Joint interface reaction control technology

Joint interface structure is refined by the replacement of Ni with Cu, which enhances joint strength

Joint interface reaction control technology

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