Cost reduction by low-Ag
Features
- Halogen-free is also available.
- The equivalent profile of M705 (SAC305) can be applied to M40-LS720V.
- Joint reliability of Sn-Cu solder is enhanced through the addition of materials such as Ag, Bi and/or Ni.
Evaluation on chip resistors
Comparison of microstructure
Joint interface reaction control technology
Joint interface structure is refined by the replacement of Ni with Cu, which enhances joint strength