Senju Metal Industry Co., Ltd. will participate in the 21st IC & Sensor Packaging Technology Expo conducted at Tokyo Big Sight for three days from January 15th to 17th, 2020, coinciding with Nepcon Japan 2020.

Under the "Beyond Connection～For Smart Home～" theme, we will introduce the usage examples of solder materials which solve the issues of electronics utilized for "Smart Homes."
We look forward to seeing you at our booth.

About

Products

• Solder paste "L29-145HF"
• Solder preforms

Presentations at our booth

• Proposal for weak heat-resistant parts "Low Temperature Solder"
• Proposal for high power parts "Solder Preforms"

Seminars at other locations

Solder Material Development & Solution Proposal for 5G　

Shunsaku Yoshikawa
Senior Researcher

Solder Technical Center, R&D Engineering Div.

January 15 (Wed) 10:30 - 12:00 / Conference Tower

For more details and application

Development Trend of Die Attach Materials for Power Semiconductors

Yoshie Tachibana
Senior Researcher
Taguchi Laboratory, Technical Center

January 15 (Wed) 10:30 - 12:00 / Conference Tower

For more details and application

Soldering materials that support the heat dissipation of next-generation semiconductors

Masato Shimamura

General Manager
Solder Technical Center, R&D Engineering Div.

January 16 (Thu) 11:00 - 12:00 / Presentation Room #6 at 2nd Floor in West Hall

For more details