21st IC & Sensor Packaging Technology EXPO

December 12, 2019

smicbooth_1.pngSenju Metal Industry Co., Ltd. will participate in the 21st IC & Sensor Packaging Technology Expo conducted at Tokyo Big Sight for three days from January 15th to 17th, 2020, coinciding with Nepcon Japan 2020.

Under the "Beyond Connection~For Smart Home~" theme, we will introduce the usage examples of solder materials which solve the issues of electronics utilized for "Smart Homes."
We look forward to seeing you at our booth.

About

Show Name 21st IC & Sensor Packaging Technology EXPO
Dates January 15 (Wed) - 17 (Fri), 2020
10:00-18:00 (Last day until 17:00)
Venue Tokyo Big Sight, Japan
Booth No. W9-8

Products

  • Solder paste "L29-145HF"
  • Solder preforms

Presentations at our booth

  • Proposal for weak heat-resistant parts "Low Temperature Solder"
  • Proposal for high power parts "Solder Preforms"

Seminars at other locations

YoshikawaJK.png Solder Material Development & Solution Proposal for 5G 

Shunsaku Yoshikawa
Senior Researcher

Solder Technical Center, R&D Engineering Div.

January 15 (Wed) 10:30 - 12:00 / Conference Tower

For more details and application

TachibanaJK.pngDevelopment Trend of Die Attach Materials for Power Semiconductors

Yoshie Tachibana
Senior Researcher
Taguchi Laboratory, Technical Center

January 15 (Wed) 10:30 - 12:00 / Conference Tower

For more details and application

ShimamuraTB.pngSoldering materials that support the heat dissipation of next-generation semiconductors

Masato Shimamura

General Manager
Solder Technical Center, R&D Engineering Div.

January 16 (Thu) 11:00 - 12:00 / Presentation Room #6 at 2nd Floor in West Hall

For more details

Contact

Senju Metal Industry Co., Ltd.
CSR & Public Relations Div., Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan
TEL: 03-3888-5151 Email: web@senju.com