Senju Metal Industry Co., Ltd. will be exhibiting at 18th International Automotive Electronics Technology Expo, which will be held at Tokyo Big Sight next week from January 21(Wed) to January 23(Fri), 2026.

This exhibition is the largest specialized exhibitions in Japan, gathering together electronic components, semiconductors, mounting technologies, manufacturing equipment, and other products that support next-generation automobiles.
The SMIC Group will be exhibiting at the largest booths in the exhibition, showcasing its latest technologies and solutions for a market where the electrification and sophistication of automobiles is accelerating through actual product displays and demonstrations.

The theme of our exhibition is "From Joining to heat dissipation ,The Technology Powering the World."
We will not only propose solder materials alone, but also explain to visitors how we can address the challenges of automotive mounting, such as high reliability, environmental friendliness, and productivity improvement, as a "comprehensive technology" that combines materials, equipment, processes, and analysis across the board.

*The image is for illustrative purposes only. The design is subject to change.

We look forward to seeing you at our booth soon!

Exhibition overview

Technology Seminar -New TechTrend-

Provide a detailed introduction to the principles and features of solder materials, focusing on approaches for achieving high-reliability implementation, evaluation methods, and the latest trends in automotive applications.