Senju Metal Industry Co., Ltd. exhibited at the 18th International Automotive Electronics Technology Expo, held at Tokyo Big Sight for three days from January 21 (Wed) to January 23 (Fri) 2026.

The theme of our exhibition was "From Joining to heat dissipation ,The Technology Powering the World."
We presented proposals on both equipment and materials for on-board joining technology, which is evolving with the shift to xEVs. We also introduced environmentally friendly yet high-performance soldering materials and the SMIC Group's efforts to automate production systems. We also set up The Industrial Analysis Service Ltd. (IAS) corner, where we introduced a wide range of new technologies and services in each corner.

Thank you for coming.