Senju Metal Industry Co., Ltd. will present its exhibit at 2nd NEPCON Osaka to be held at INTEX OSAKA for three days from May 13 (Wed) to May 15 (Fri) 2026.

This time, NEPCON OSAKA,Approximately 620 companies※ are scheduled to exhibit at the event,and the latest technologies supporting the increased functionality and performance of electronic devices, semiconductors, and power devices will be introduced all in one place.
Visitors will mainly be professionals from a wide range of fields, including electronics, semiconductors and sensors, electronic components, automobiles and electrical equipment, and aerospace, and are expected to come to introduce and compare the latest technologies.The event is attracting attention as a starting point for technological innovation in the Kansai region.

The company in collaboration with MEISHO Co., Ltd., will be exhibiting the latest reflow ovens and solder materials at the "Next-Generation SMT Minimalist Workforce Experience Booth".We will also be sponsoring the "IPC Soldering Contest Japan," a competition showcasing world-standard soldering skills, and will be providing GAO-WR as the competition solder. This competition is the second-round domestic qualifier for the world championships held in Germany, and will feature a heated competition among Japan's top-class solderers. Everyone is welcome to watch, so please come and see the masterful soldering techniques up close.
We look forward to seeing you at our booth soon!

※This is the number of planned exhibitors including concurrent exhibitions.

Exhibition overview