SENJU Solder Products

SENJU leads the field in the development and testing of lead free soldering solutions. Having jointly patented its first lead free alloy in 1992, the Company has accumulated great wealth of data on the performance of a wide range of lead free alloys and has acquired the expertise to make the lead free process work efficiently. Senju offers the complete range of lead free solutions for reflow soldering, wave soldering and manual attachment and rework, in the forms of lead free solder paste, lead free alloys, lead free flux cored solder wire and solder spheres.

For further details on lead free solutions

Senju’s Sparkle Paste OZ series removes the “im” from “impossible”. Formulated using a range of alloys and spherical oxide zero solder powders. With closely controlled particle distribution and highly stable flux technology, sparkle solder paste exhibit outstanding printing characteristics. With controlled Rheology this enables crisp, fine pitch deposits to be printed without slumping, either with squeegees or enclosed head systems. The standard alloy range includes Anti-tombstoning products that prevent tombstoning using twin peak melting point technology. Senju Sparkle Paste OZ series of products are suitable for surface mount assembly and many other reflow soldering applications including component assembly, sealing, bumping, die bonding and induction soldering.

Sparkle flux cored solder wire was first introduced in 1955. Using a high reliability manufacturing process that guarantees flux core continuity, SENJU has developed a wide range of wires with diverse alloy and flux types to meet the varying requirements of specialised applications. From RMA no clean products to fully active cored wire for soldering metal with an oxidised surface film, SENJU has an extensive range of flux cored wire, all characterised by their outstanding performance.

Sparkle Spheres are small solder balls used in the manufacture of BGAs, CSPs, and a variety of micro soldering applications. The solder balls are manufactured to extremely tight tolerances with exceptionally clean surfaces and are packed in inert gas to inhibit oxidation and preserve solderability.