SENJU News

Lead content of Senju Lead-free solder is now less then 0.05%

Standardisation of Lead-free solder alloy is presently under discussion and it will be determined in 2005. The standard value of lead contained in the solder material as an impurity is considered under 0.10% by ISO 9453, IEC 61190-1-3 and JIS Z3282.

In addition, lead content within the solder joint will also have to be controlled to less then 0.10%. This is in accordance with the RoHS Directive which will be enforced as of July 2006. However, with the slower transition of changing component solder plating parts of leads or terminals into lead-free in the run up to July 2006. There is always the possibility of having issues in meeting these requirements.

In order to meet the growing compliance requirements from all industry sectors, as of September 2004, Senju’s Lead-free solder product will have less then 0.05% of lead impurities within the raw material production.

Thereby we believe that not only Senju, but our clients can provide products in accordance with the RoHS Directives.

Please understand these changes may be temporary measures and may change in response to RoHS regulation amendments.