Makes low-cost, high-quality die bonding a reality
Features
- The wire method allows mounting at a cheaper price than the preform method
- Fewer surface scratches and oxide film deposits combined with good wettability make fluxless mounting possible
- Superb condition of the wire surface suppresses the formation of voids
Example of use
The wire method is a cheaper way of die bonding than the preform method
Example of die bonding
Wettability and voids
